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MicroPak Automotive Q100
Nexperia's automotive-qualified Mini Logic types in leadless XSON packages
Nexperia's MicroPak Automotive Q100 addresses space constraints in automotive applications with innovative MicroPak solutions that exceed AEC-Q100 requirements. The Nexperia Q100 portfolio now includes more than 20 automotive-qualified functions in XSON leadless extremely-thin small-outline packages.
Features
- Very small footprint: up to 60% space saving over equivalent leaded packages
- Optimized for speed and power
- Low propagation delay
- Low dynamic power dissipation
- Specified for partial power-down applications using IOFF
Applications
- Infotainment
- ADAS
- BMS
MicroPak Automotive Q100
| Image | Manufacturer Part Number | Description | Available Quantity | Price | View Details | |
|---|---|---|---|---|---|---|
 |  | 74AUP1G125GM-Q100X | IC BUFF 0.8V/3.6V 6-XSON, SOT886 | 4344 - Immediate | $0.31 | View Details |
|  | 74AUP1G125GS-Q100H | IC BUFF 0.8V/3.6V | 4321 - Immediate | $0.31 | View Details |
|  | 74AUP1G02GW-Q100H | IC NOR 1-CIR 2-IN 5-TSSOP | 2052 - Immediate | $0.21 | View Details |
| | 74AUP1G04GW-Q100H | IC INV 1-CIR 1-IN 5-TSSOP | 5248 - Immediate | $0.21 | View Details |
|  | 74AUP2GU04GW-Q100H | IC INV 2-CIR 2-IN 6-TSSOP | 4404 - Immediate | $0.31 | View Details |
Published: 2020-09-30
