Toshiba TDS5B212MX and TDS5C212MX MuxDe-mux – PTM | DigiKey

Welcome to this Product Training Module for Toshiba’s TDS5B212MX and TDS5C212MX two to one differential bus switches. These are high-speed differential mux and demux devices for expanding high-speed interfaces including PCIe 6.0, CXL 3.0, USB4, and Thunderbolt 5.

The TDS5 series switches a single serial lane between a host and one of two connected devices. A serial lane consists of two differential pairs, one for transmit and another for receive, for a total of four circuits. These are passive switches, which simply route signals without applying any correction or regeneration. Compared to active devices, sometimes called redrivers or retimers, passive switching can offer reduced switching latency, lower power consumption, and greater design flexibility in some applications.

The devices have a select input to connect port A to either port B or port C. They also have an output enable input that can be used to disconnect all ports from each other. They’re housed in a 16 pin 2.4 by 1.6 millimeter XQFN package with a 0.4 millimeter max height. The device operates from a 1.6 to 3.6 volt supply with a 70 microamp typical current draw. The control pins support 0 to 3.6 volt inputs and the switch I/Os support 0 to 1.8 volt differential signals.

The TDS5B212MX and TDS5C212MX differ in their pinout, which also impacts their high frequency performance.

TDS5B212MX has a 29 gigahertz 3 dB bandwidth using the same pin assignments as the previous generation TDS4 series, which was designed for data rates up to 32 gigabits per second.

TDS5C212MX swaps certain pins to optimize signal routing and achieve a 3 dB bandwidth of 34 gigahertz.

While both models support 64 gigatransfers per second, such as PCIe 6.0, the difference in layout provides modest gains in eye diagram metrics between the TDS5B212MX and TDS5C212MX, providing additional signal integrity margin.

The TDS5B212MX and TDS5C212MX are suitable for signal path sharing in demanding high-speed differential signal systems including servers, industrial testers, robots, mobile devices, and even wearable devices due to their compact package and high-speed performance.