Configuración
Entrega rápida
Tipos de pago
Producto del mercado
Slide 1
Slide 2
Slide 3
Slide 4
Slide 5
Slide 6
Slide 7
Slide 8
Slide 9
Slide 10
Slide 11
Slide 12
Slide 13
Slide 14
Slide 15
Slide 16
Product List
In contrast with MFSOP6 package, SO6 package is 20% thinner and is excellent for height constrained designs. It can also be used to reduce overall board space by mounting thinner components on the reverse side of the PCB.
PTM Published on: 2013-01-22
