Image of Meeting Modern Edge Computing Demands with the Tachyon Single-Board Computer Meeting Modern Edge Computing Demands with the Tachyon Single-Board Computer Publish Date: 2026-09-10

The Particle Tachyon single-board computer combines a Qualcomm QCM6490, Linux computing, AI acceleration, and integrated 5G for edge AI and IoT deployments.

Image of Enhancing Situational Awareness on the Plant or Factory Floor Enhancing Situational Awareness on the Plant or Factory Floor Publish Date: 2026-09-09

Banner SD50 Status Displays and K100 Programmable Beacons offer a simple, cost-effective solution for alerting workers in industrial settings.

Image of Maintain Interconnect Integrity at Cryogenic Extremes with Deep Space Connectors Maintain Interconnect Integrity at Cryogenic Extremes with Deep Space Connectors Publish Date: 2026-09-08

Learn how space-grade circular connectors with upgraded elastomers help maintain environmental sealing and connectivity through cryogenic thermal extremes.

Image of Design Power Converters with GaN Technology to Meet the Demands of AI Datacenters Design Power Converters with GaN Technology to Meet the Demands of AI Datacenters Publish Date: 2026-09-03

Learn how the onsemi GaNEXUS power portfolio supports smaller, more efficient power converters to reduce heat generation in AI datacenters.

Image of Build a Custom 8-Bit Absolute Linear Encoder with SPI Build a Custom 8-Bit Absolute Linear Encoder with SPI Publish Date: 2026-09-02

Build a custom 8-bit, absolute linear encoder with infrared reflective sensors, comparators, and a shift register (for data collection and SPI delivery).

Image of Explore Modern Isolation Strategies for Medical Device Designs Explore Modern Isolation Strategies for Medical Device Designs Publish Date: 2026-09-01

Learn how ADI's modern isolation components help medical device designers meet IEC 60601-1 requirements for MOPP, MOOP, leakage current, and safety.

Image of Use MEMS-based TCXOs for Precise and Stable Timing in Harsh Environments Use MEMS-based TCXOs for Precise and Stable Timing in Harsh Environments Publish Date: 2026-08-27

Use MEMS for stable, precise timing in a compact form factor for harsh environments.

Image of How to Select Hall Effect Sensors for Harsh Environments How to Select Hall Effect Sensors for Harsh Environments Publish Date: 2026-08-26

Rugged Hall effect switches and latches simplify closure, valve, and motor sensing in automotive and industrial systems.

Image of Selecting Board-to-Board Connectors for Reliable Multi-PCB Designs Selecting Board-to-Board Connectors for Reliable Multi-PCB Designs Publish Date: 2026-08-25

Select board-to-board connectors by balancing alignment, assembly, reliability, and cost in multi-PCB designs.

Image of Rugged Nano-D Connectors Deliver Mission-Critical Gigabit Connectivity in Challenging Environments Rugged Nano-D Connectors Deliver Mission-Critical Gigabit Connectivity in Challenging Environments Publish Date: 2026-08-20

Nano-D Connectors with Flex Pin technology create secure connections that tolerate misalignment, vibration, and shock to provide up to 20 Gbps of connectivity.

Image of Compression vs. Mechanical Connectors: Which Provides the Most Reliable Connection? Compression vs. Mechanical Connectors: Which Provides the Most Reliable Connection? Publish Date: 2026-08-19

How compression and mechanical connections differ at the conductor-lug interface and how installation methods affect the consistency of the finished connection.

Image of Enhance Power Supply Efficiency Through Improved Thermal Management Enhance Power Supply Efficiency Through Improved Thermal Management Publish Date: 2026-08-18

Learn how using thermal design best practices and dedicated cooling controllers helps improve power supply efficiency and reliability.

Image of Simplifying discrete power design Simplifying Discrete Power Design Publish Date: 2026-08-14

Explore how RECOM simplifies isolated power supply design with pre-validated power ICs and matched transformers for flexible, scalable solutions.

Image of Delta’s PJ Series is built for compact spaces, peak loads, and harsh environments Delta’s PJ Series is built for compact spaces, peak loads, and harsh environments Publish Date: 2026-08-14

Delta’s PJ Series delivers compact, efficient power with 200% peak load capability, wide inputs, conformal coating, and harsh-environment protection.

Image of Renesas’ RRW11011 Shrinks 500 W GaN Power Designs with One Chip for PFC and LLC Renesas’ RRW11011 Shrinks 500 W GaN Power Designs with One Chip for PFC and LLC Publish Date: 2026-08-14

Explore how Renesas’ RRW11011 combines interleaved PFC and half-wave LLC control for compact, efficient GaN-based AC/DC power supplies up to 500 W.

Image of Configuring four-switch buck-boost μModule regulators for versatile applications: step-up, step-down, or inverting output Configuring four-switch buck-boost μModule regulators for versatile applications: step-up, step-down, or inverting output Publish Date: 2026-08-14

Explore how the LTM4712 four-switch buck-boost μModule regulator delivers efficient step-up, step-down and inverting power conversion.

Image of Are you ready for Level VII efficiency? Are you ready for Level VII efficiency? Publish Date: 2026-08-14

Explore DOE Level VII efficiency standards, their impact on power supply design, and how Advanced Energy Solutions help meet new requirements.

Image of Vicor Power Modules Simplify High-Voltage Conversion for the Shift to 48 V Vicor Power Modules Simplify High-Voltage Conversion for the Shift to 48 V Publish Date: 2026-08-14

Explore how Vicor power modules enable efficient high-voltage to 48 V conversion for computing, automotive, robotics, and industrial systems.

Image of Improve Industrial System Reliability with Compact, High-Density Ribbon Cables Improve Industrial System Reliability with Compact, High-Density Ribbon Cables Publish Date: 2026-08-11

Learn how the 3M 451 series socket assemblies and 452 series board-mount headers simplify wire-to-board interconnects for space-constrained industrial designs.

Image of How to Increase Power Density and Simplify Cooling Using Advanced MOSFETs How to Increase Power Density and Simplify Cooling Using Advanced MOSFETs Publish Date: 2026-08-05

Use top-side cooled (TSC) SiC MOSFETs to increase power density and simplify cooling across automotive, data server, motor drive, and power conversion systems.

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